do you think i can use a copper heatsink pad instead of the adhesive pad to make contact with the case?

For a Raspbery Pi 3 B+ is not necessary, just apply some thermal paste between the cpu and Flirc case and you'll get better heat transfer instead of using the included thermal pad, screw case tightly. If using a Raspberry Pi 3 (Not the 3 B+) then what I did on mine was using a copper shim of 1mm and applied arctic silver thermal adhesive between the copper shim and the Flirc case, after fully dried then apply thermal paste between the now permanently glued in shim in the case and the Raspberry Pi 3 cpu. On both cases, it was the perfect solution to achieve the maximum overclock that the chip can without overheating and using a passive heatsink solution (no fans).

Brand	Flirc
Item model number	FL-70462
Item Weight	4 ounces
Product Dimensions	0.8 x 0.44 x 1.6 inches
Item Dimensions LxWxH	0.8 x 0.44 x 1.6 inches
Color	Silver
Manufacturer	Flirc
ASIN	B07349HT26
Is Discontinued By Manufacturer	No
Date First Available	June 22, 2017

Flirc Raspberry Pi 3 Case

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